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https://soar-ir.repo.nii.ac.jp/oai
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2022-12-14T04:19:34Z
1221:1222
Fabrication of copper/single-walled carbon nanotube composite film with homogeneously dispersed nanotubes by electroless deposition
Arai, Susumu
Osaki, Takuma
Hirota, Mitsuhito
Uejima, Mitsugu
© 2016 The Authors. Published by Elsevier Ltd. This is an open access article under the CC BY-NC-NDlicense (http://creativecommons.org/licenses/by-nc-nd/4.0/).
Single-walled carbon nanotube
Copper
Composite
Electroless deposition
Copper/single-walled carbon nanotube (SWCNT) composite films were fabricated by electroless deposition. The SWCNTs were formed using the water-assisted chemical vapor deposition method. To prepare copper/SWCNT composite plating baths with homogeneously dispersed SWCNTs, magnetic stirring, ultrasonic homogenization, and collision-type atomization were examined as mechanical methods for the disintegration of SWCNT bundles. Appropriate dispersants were added to the plating baths to avoid re-aggregation of the disintegrated SWCNTs. The degree of SWCNT dispersion in the copper/SWCNT composite plating bath was evaluated using a particle size analyzer, and the microstructures of the copper/SWCNT composite films were analyzed using scanning electron microscopy and X-ray diffraction. Collision-type atomization most significantly improved the degree of SWCNT dispersion in the composite plating bath. Using this treatment method, copper/SWCNT composite films with homogeneous dispersions of SWCNTs were successfully fabricated by electroless deposition. (C) 2016 The Authors. Published by Elsevier Ltd. This is an open access article under the CC BY-NC-ND license (http://cleativecommonhorghicensehby-nc-nd74,0/).
Article
MATERIALS TODAY COMMUNICATIONS. 7:101-107 (2016)
ELSEVIER SCIENCE BV
2016-06
eng
journal article
VoR
http://hdl.handle.net/10091/00022446
https://soar-ir.repo.nii.ac.jp/records/21689
https://doi.org/10.1016/j.mtcomm.2016.04.009
10.1016/j.mtcomm.2016.04.009
2352-4928
MATERIALS TODAY COMMUNICATIONS
7
101
107
https://soar-ir.repo.nii.ac.jp/record/21689/files/1-s2.0-S235249281530026X-main.pdf
application/pdf
2.8 MB
2021-01-13