2024-03-29T14:20:06Z
https://soar-ir.repo.nii.ac.jp/oai
oai:soar-ir.repo.nii.ac.jp:00021690
2022-12-14T04:19:34Z
1221:1222
Fabrication of Three-Dimensional (3D) Copper/Carbon Nanotube Composite Film by One-Step Electrodeposition
Arai, Susumu
Ozawa, Masaya
Shimizu, Masahiro
© The Author(s) 2016. Published by ECS. This is an open access article distributed under the terms of the Creative Commons Attribution 4.0 License (CC BY, http://creativecommons.org/licenses/by/4.0/), which permits unrestricted reuse of the work in any medium, provided the original work is properly cited.
A three-dimensional (3D) composite film containing copper nanostructures and carbon nanotubes (3DC/CNT composite film) was fabricated by one-step electrodeposition. The 3DC/CNT composite film was formed under galvanostatic conditions using a copper sulfate bath containing CNTs and polyacrylic acid which acts as both a 3DC-forming and a CNT-dispersing agent. The composite film consists of thin copper sheets with thicknesses of ca. 70-80 nm and CNTs, with large interior spaces between sheets. The CNTs were homogeneously distributed inside the composite film and were fixed by the copper sheets where CNTs pierce the copper sheets. The CNT content in the composite films increased with the CNT concentration of the plating bath. The 3DC film without CNTs did not maintain its 3D spaces when the film thickness was increased due to insufficient structural strength, whereas the 3DC/CNT composite film maintained the 3D spaces despite an increase in film thickness, which suggests that the CNTs reinforce the film to maintain the 3D spaces. (C) The Author(s) 2016. Published by ECS. All rights reserved.
Article
JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 163(14):D774-D779 (2016)
ELECTROCHEMICAL SOC INC
2016
eng
journal article
VoR
http://hdl.handle.net/10091/00022447
https://soar-ir.repo.nii.ac.jp/records/21690
https://doi.org/10.1149/2.0601614jes
10.1149/2.0601614jes
0013-4651
AA00697016
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
163
14
D774
D779
https://soar-ir.repo.nii.ac.jp/record/21690/files/Arai_2016_J._Electrochem._Soc._163_D774.pdf
application/pdf
1.8 MB
2021-01-13