2024-03-29T14:37:00Z
https://soar-ir.repo.nii.ac.jp/oai
oai:soar-ir.repo.nii.ac.jp:02000685
2022-12-14T04:09:58Z
1221:1222
Multi-layered copper foil reinforced by co-deposition of single-walled carbon nanotube based on electroplating technique
Shimizu, Masahiro
Ogasawara, Takayuki
Ohkuni, Tomonari
Arai, Susumu
Article
Materials Letters. 261: 126993 (2020)
IOP Publishing
2020-02-15
eng
journal article
AM
http://hdl.handle.net/10091/0002000685
https://soar-ir.repo.nii.ac.jp/records/2000685
https://doi.org/10.1016/j.matlet.2019.126993
10.1016/j.matlet.2019.126993
1873-4979
Materials Letters
261
126993
https://soar-ir.repo.nii.ac.jp/record/2000685/files/18K14317_3.pdf
application/pdf
2022-01-19