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2022-12-14T04:19:33Z
1221:1222
Communication-Fabrication of a Uniformly Tin-Coated Three-Dimensional Copper Nanostructured Architecture by Electrodeposition
Arai, Susumu
Mendsaikhan, Munkhbat
Nishimura, Koichi
A three-dimensional copper nanostructure architecture (3DC1) coated uniformly with a tin film was fabricated by electrodeposition. In these trials, a pyrophosphate bath was used for tin plating, and the effects of polyethylene glycol and formaldehyde additives on the morphology of the deposited tin were investigated. Relatively large tin particles were electrodeposited in an inhomogeneous manner over the 3DC1 surface when using a plating bath without additives. In contrast, 3DC1 coated with a uniformly thick tin film was fabricated by employing a bath with the additives. (C) The Author(s) 2015. Published by ECS.
Article
JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 163(2):D54-D56 (2016)
journal article
ELECTROCHEMICAL SOC INC
2016
application/pdf
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
2
163
D54
D56
0013-4651
AA00697016
https://soar-ir.repo.nii.ac.jp/record/21687/files/Arai_2016_J._Electrochem._Soc._163_D54.pdf
eng
10.1149/2.0831602jes
https://doi.org/10.1149/2.0831602jes
© The Author(s) 2015. Published by ECS. This is an open access article distributed under the terms of the Creative Commons Attribution 4.0 License (CC BY, http://creativecommons.org/licenses/by/4.0/), which permits unrestricted reuse of the work in any medium, provided the original work is properly cited.