{"created":"2021-03-01T06:15:13.863933+00:00","id":12321,"links":{},"metadata":{"_buckets":{"deposit":"85cc7214-8e15-48ec-9185-5f303b800011"},"_deposit":{"id":"12321","owners":[],"pid":{"revision_id":0,"type":"depid","value":"12321"},"status":"published"},"_oai":{"id":"oai:soar-ir.repo.nii.ac.jp:00012321","sets":["1221:1222"]},"author_link":["37443","37444"],"item_1628147817048":{"attribute_name":"出版タイプ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_970fb48d4fbd8a85","subitem_version_type":"VoR"}]},"item_6_biblio_info_6":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2014","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"5","bibliographicPageEnd":"D9","bibliographicPageStart":"D7","bibliographicVolumeNumber":"3","bibliographic_titles":[{"bibliographic_title":"ECS ELECTROCHEMISTRY LETTERS"}]}]},"item_6_description_20":{"attribute_name":"抄録","attribute_value_mlt":[{"subitem_description":"Three-dimensional (3D) copper nanostructured architectures were fabricated on a copper substrate using a simple electrodeposition technique. An acid copper sulfate bath was used for copper plating with polyacrylic acid (PA) as an additive and electrodeposition was performed under galvanostatic conditions. The surface morphology of the electrodeposited copper films was significantly changed and a 3D nanostructured architecture that consisted of highly porous 50 nm thick sheet-like copper deposits was obtained by the addition of PA. It is considered that such a 3D nanostructured architecture could be applied as a current collector for lithium-ion battery anodes.","subitem_description_type":"Abstract"}]},"item_6_description_30":{"attribute_name":"資源タイプ（コンテンツの種類）","attribute_value_mlt":[{"subitem_description":"Article","subitem_description_type":"Other"}]},"item_6_description_5":{"attribute_name":"引用","attribute_value_mlt":[{"subitem_description":"ECS ELECTROCHEMISTRY LETTERS. 3(5):D7-D9 (2014)","subitem_description_type":"Other"}]},"item_6_link_3":{"attribute_name":"信州大学研究者総覧へのリンク","attribute_value_mlt":[{"subitem_link_text":"Arai, Susumu","subitem_link_url":"http://soar-rd.shinshu-u.ac.jp/profile/ja.jUyhbpkh.html"}]},"item_6_link_67":{"attribute_name":"WoS","attribute_value_mlt":[{"subitem_link_url":"http://gateway.isiknowledge.com/gateway/Gateway.cgi?&GWVersion=2&SrcAuth=ShinshuUniv&SrcApp=ShinshuUniv&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000333804400005"}]},"item_6_publisher_4":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"ELECTROCHEMICAL SOC INC"}]},"item_6_relation_48":{"attribute_name":"DOI","attribute_value_mlt":[{"subitem_relation_name":[{"subitem_relation_name_text":"10.1149/2.004405eel"}],"subitem_relation_type_id":{"subitem_relation_type_id_text":"https://doi.org/10.1149/2.004405eel","subitem_relation_type_select":"DOI"}}]},"item_6_rights_62":{"attribute_name":"権利","attribute_value_mlt":[{"subitem_rights":"Copyright© The Electrochemical Society, Inc. 2014. All rights reserved. Except as provided under U.S. copyright law, this work may not be reproduced, resold, distributed, or modified without the express permission of The Electrochemical Society (ECS). The archival version of this work was published in ECS Electrochem. Lett. 2014 volume 3, issue 5, D7-D9."}]},"item_6_source_id_35":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"2162-8726","subitem_source_identifier_type":"ISSN"}]},"item_6_source_id_40":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_source_identifier":"AA1258269X","subitem_source_identifier_type":"NCID"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"Arai,  Susumu"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Kitamura,  Tomoya"}],"nameIdentifiers":[{}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2015-09-28"}],"displaytype":"detail","filename":"Simple_Method_Fabrication_Three-Dimensional.pdf","filesize":[{"value":"627.5 kB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"Simple_Method_Fabrication_Three-Dimensional.pdf","url":"https://soar-ir.repo.nii.ac.jp/record/12321/files/Simple_Method_Fabrication_Three-Dimensional.pdf"},"version_id":"7433b7d9-394b-47d4-b3dd-1d5e9b095a63"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"eng"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"journal article","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"Simple Method for Fabrication of Three-Dimensional (3D) Copper Nanostructured Architecture by Electrodeposition","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"Simple Method for Fabrication of Three-Dimensional (3D) Copper Nanostructured Architecture by Electrodeposition","subitem_title_language":"en"}]},"item_type_id":"6","owner":"1","path":["1222"],"pubdate":{"attribute_name":"PubDate","attribute_value":"2014-07-09"},"publish_date":"2014-07-09","publish_status":"0","recid":"12321","relation_version_is_last":true,"title":["Simple Method for Fabrication of Three-Dimensional (3D) Copper Nanostructured Architecture by Electrodeposition"],"weko_creator_id":"1","weko_shared_id":-1},"updated":"2022-12-14T04:05:58.491051+00:00"}