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  1. 060 工学部
  2. 0601 学術論文

Effects of Additives on Cu-MWCNT Composite Plating Films

http://hdl.handle.net/10091/10860
http://hdl.handle.net/10091/10860
5c68a07d-25cd-48a5-8ce9-d0fc74723086
名前 / ファイル ライセンス アクション
Effects_Additives_Cu-MWCNT_Composite.pdf Effects_Additives_Cu-MWCNT_Composite.pdf (1.0 MB)
Item type 学術雑誌論文 / Journal Article(1)
公開日 2011-01-05
タイトル
言語 en
タイトル Effects of Additives on Cu-MWCNT Composite Plating Films
言語
言語 eng
キーワード
主題Scheme Other
主題 additives
キーワード
主題Scheme Other
主題 carbon nanotubes
キーワード
主題Scheme Other
主題 copper
キーワード
主題Scheme Other
主題 current density
キーワード
主題Scheme Other
主題 electrical resistivity
キーワード
主題Scheme Other
主題 electrodeposits
キーワード
主題Scheme Other
主題 electrolytes
キーワード
主題Scheme Other
主題 field emission
キーワード
主題Scheme Other
主題 metallic thin films
キーワード
主題Scheme Other
主題 nanocomposites
キーワード
主題Scheme Other
主題 surface morphology
資源タイプ
資源 http://purl.org/coar/resource_type/c_6501
タイプ journal article
著者 Arai, Susumu

× Arai, Susumu

WEKO 38167

Arai, Susumu

Search repository
Saito, Takashi

× Saito, Takashi

WEKO 38168

Saito, Takashi

Search repository
Endo, Morinobu

× Endo, Morinobu

WEKO 38169

Endo, Morinobu

Search repository
信州大学研究者総覧へのリンク
氏名 Arai, Susumu
URL http://soar-rd.shinshu-u.ac.jp/profile/ja.jUyhbpkh.html
信州大学研究者総覧へのリンク
氏名 Endo, Morinobu
URL http://soar-rd.shinshu-u.ac.jp/profile/ja.uUTmZhkh.html
出版者
出版者 ELECTROCHEMICAL SOC INC
引用
内容記述タイプ Other
内容記述 JOURNAL OF THE ELECTROCHEMICAL SOCIETY
書誌情報 JOURNAL OF THE ELECTROCHEMICAL SOCIETY

巻 157, 号 3, p. D127-D134, 発行日 2010-01
抄録
内容記述タイプ Abstract
内容記述 The effects of plating bath additives on copper-multiwalled carbon nanotube (MWCNT) composite platings were studied. An acidified cupric sulfate electrolyte containing MWCNTs and polyacrylic acid as a dispersing agent was used as the base plating bath. Chloride ions (Cl⁻), poly(ethylene glycol), bis(3-sulfopropyl)disulfide (SPS), and Janus green B (JGB) were examined as additives. The surface morphologies and cross-sectional microstructures of the electrodeposited films were investigated, and the MWCNT content of the films was determined. Furthermore, the electrical resistivity and field emission properties of the films were evaluated. The simultaneous addition of Cl⁻, SPS, and JGB to the base plating bath was effective for forming smooth Cu-MWCNT composite films with a high MWCNT content over a wider range of current densities. The optimal bath composition was 0.85 mol dm⁻³ CuSO₄・5H₂O+0.55 mol dm⁻³ H₂SO₄+100 ppm PA5000+2 g dm⁻³ MWCNTs+2 ppm SPS + 2 ppm JGB +50 ppm Cl⁻. Cu-MWCNT composite films containing 0.15–0.33 mass % MWCNTs with smooth surface morphologies were formed in the current density range of 0.5–5 A dm⁻². The electrical resistivity of the films was around 2 μΩ cm, and they showed obvious field emission properties.
資源タイプ(コンテンツの種類)
内容記述タイプ Other
内容記述 Article
ISSN
収録物識別子タイプ ISSN
収録物識別子 0013-4651
書誌レコードID
収録物識別子タイプ NCID
収録物識別子 AA00697016
DOI
識別子タイプ DOI
関連識別子 https://doi.org/10.1149/1.3274202
関連名称 10.1149/1.3274202
権利
権利情報 Copyright (c) The Electrochemical Society, Inc. 2010. All rights reserved. Except as provided under U.S. copyright law, this work may not be reproduced, resold, distributed, or modified without the express permission of The Electrochemical Society (ECS). The archival version of this work was published in J. Electrochem. Soc. 157(3):D127-D134 (2010), DOI:10.1149/1.3274202
出版タイプ
出版タイプ VoR
出版タイプResource http://purl.org/coar/version/c_970fb48d4fbd8a85
WoS
表示名 Web of Science
URL http://gateway.isiknowledge.com/gateway/Gateway.cgi?&GWVersion=2&SrcAuth=ShinshuUniv&SrcApp=ShinshuUniv&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000274321900047
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