{"created":"2021-03-01T06:15:25.065336+00:00","id":12505,"links":{},"metadata":{"_buckets":{"deposit":"badeb1de-f3bf-4643-8b50-4b42db5c5082"},"_deposit":{"id":"12505","owners":[],"pid":{"revision_id":0,"type":"depid","value":"12505"},"status":"published"},"_oai":{"id":"oai:soar-ir.repo.nii.ac.jp:00012505","sets":["1221:1222"]},"author_link":["38167","38168","38169"],"item_1628147817048":{"attribute_name":"出版タイプ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_970fb48d4fbd8a85","subitem_version_type":"VoR"}]},"item_6_biblio_info_6":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2010-01","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"3","bibliographicPageEnd":"D134","bibliographicPageStart":"D127","bibliographicVolumeNumber":"157","bibliographic_titles":[{"bibliographic_title":"JOURNAL OF THE ELECTROCHEMICAL SOCIETY"}]}]},"item_6_description_20":{"attribute_name":"抄録","attribute_value_mlt":[{"subitem_description":"The effects of plating bath additives on copper-multiwalled carbon nanotube (MWCNT) composite platings were studied. An acidified cupric sulfate electrolyte containing MWCNTs and polyacrylic acid as a dispersing agent was used as the base plating bath. Chloride ions (Cl⁻), poly(ethylene glycol), bis(3-sulfopropyl)disulfide (SPS), and Janus green B (JGB) were examined as additives. The surface morphologies and cross-sectional microstructures of the electrodeposited films were investigated, and the MWCNT content of the films was determined. Furthermore, the electrical resistivity and field emission properties of the films were evaluated. The simultaneous addition of Cl⁻, SPS, and JGB to the base plating bath was effective for forming smooth Cu-MWCNT composite films with a high MWCNT content over a wider range of current densities. The optimal bath composition was 0.85 mol dm⁻³　CuSO₄・5H₂O+0.55 mol dm⁻³ H₂SO₄+100  ppm PA5000+2 g dm⁻³ MWCNTs+2 ppm SPS + 2 ppm JGB +50 ppm Cl⁻. Cu-MWCNT composite films containing 0.15–0.33 mass % MWCNTs with smooth surface morphologies were formed in the current density range of 0.5–5  A  dm⁻². The electrical resistivity of the films was around 2 μΩ cm, and they showed obvious field emission properties.","subitem_description_type":"Abstract"}]},"item_6_description_30":{"attribute_name":"資源タイプ（コンテンツの種類）","attribute_value_mlt":[{"subitem_description":"Article","subitem_description_type":"Other"}]},"item_6_description_5":{"attribute_name":"引用","attribute_value_mlt":[{"subitem_description":"JOURNAL OF THE ELECTROCHEMICAL SOCIETY","subitem_description_type":"Other"}]},"item_6_link_3":{"attribute_name":"信州大学研究者総覧へのリンク","attribute_value_mlt":[{"subitem_link_text":"Arai, Susumu","subitem_link_url":"http://soar-rd.shinshu-u.ac.jp/profile/ja.jUyhbpkh.html"},{"subitem_link_text":"Endo, Morinobu","subitem_link_url":"http://soar-rd.shinshu-u.ac.jp/profile/ja.uUTmZhkh.html"}]},"item_6_link_67":{"attribute_name":"WoS","attribute_value_mlt":[{"subitem_link_url":"http://gateway.isiknowledge.com/gateway/Gateway.cgi?&GWVersion=2&SrcAuth=ShinshuUniv&SrcApp=ShinshuUniv&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000274321900047"}]},"item_6_publisher_4":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"ELECTROCHEMICAL SOC INC"}]},"item_6_relation_48":{"attribute_name":"DOI","attribute_value_mlt":[{"subitem_relation_name":[{"subitem_relation_name_text":"10.1149/1.3274202"}],"subitem_relation_type_id":{"subitem_relation_type_id_text":"https://doi.org/10.1149/1.3274202","subitem_relation_type_select":"DOI"}}]},"item_6_rights_62":{"attribute_name":"権利","attribute_value_mlt":[{"subitem_rights":"Copyright (c) The Electrochemical Society, Inc. 2010. All rights reserved. Except as provided under U.S. copyright law, this work may not be reproduced, resold, distributed, or modified without the express permission of The Electrochemical Society (ECS). The archival version of this work was published in J. Electrochem. Soc. 157(3):D127-D134 (2010), DOI:10.1149/1.3274202"}]},"item_6_source_id_35":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"0013-4651","subitem_source_identifier_type":"ISSN"}]},"item_6_source_id_40":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_source_identifier":"AA00697016","subitem_source_identifier_type":"NCID"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"Arai,  Susumu"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Saito,  Takashi"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Endo,  Morinobu"}],"nameIdentifiers":[{}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2015-09-28"}],"displaytype":"detail","filename":"Effects_Additives_Cu-MWCNT_Composite.pdf","filesize":[{"value":"1.0 MB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"Effects_Additives_Cu-MWCNT_Composite.pdf","url":"https://soar-ir.repo.nii.ac.jp/record/12505/files/Effects_Additives_Cu-MWCNT_Composite.pdf"},"version_id":"927c9580-e7f7-42da-80dd-74cdaf0e8293"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"additives","subitem_subject_scheme":"Other"},{"subitem_subject":"carbon nanotubes","subitem_subject_scheme":"Other"},{"subitem_subject":"copper","subitem_subject_scheme":"Other"},{"subitem_subject":"current density","subitem_subject_scheme":"Other"},{"subitem_subject":"electrical resistivity","subitem_subject_scheme":"Other"},{"subitem_subject":"electrodeposits","subitem_subject_scheme":"Other"},{"subitem_subject":"electrolytes","subitem_subject_scheme":"Other"},{"subitem_subject":"field emission","subitem_subject_scheme":"Other"},{"subitem_subject":"metallic thin films","subitem_subject_scheme":"Other"},{"subitem_subject":"nanocomposites","subitem_subject_scheme":"Other"},{"subitem_subject":"surface morphology","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"eng"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"journal article","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"Effects of Additives on Cu-MWCNT Composite Plating Films","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"Effects of Additives on Cu-MWCNT Composite Plating Films","subitem_title_language":"en"}]},"item_type_id":"6","owner":"1","path":["1222"],"pubdate":{"attribute_name":"PubDate","attribute_value":"2011-01-05"},"publish_date":"2011-01-05","publish_status":"0","recid":"12505","relation_version_is_last":true,"title":["Effects of Additives on Cu-MWCNT Composite Plating Films"],"weko_creator_id":"1","weko_shared_id":-1},"updated":"2022-12-14T04:30:19.355326+00:00"}