@article{oai:soar-ir.repo.nii.ac.jp:00013120,
 author = {小沼,  義治 and 小山,  恒夫},
 journal = {信州大学工学部紀要},
 month = {Dec},
 note = {In general, noble metals, Ag and Cu, are melleable and stable against corrosion, so that these metals are used with other metals to obtain soldering materials, such as silver solder, german silver solder. It has been found out that alloys Cux Ag₁₋x in the Ag-Cu system, especially Cu₂₈ Ag₇₂, are suitable to obtain ohmic contacts to p and n type silicon, heating substrates above 300℃ and evaporating the alloy on it in vacuum. Metal surfaces obtained by means of evaporation method using Ag-Cu alloys, are acceptable in soldering Sn-Pb alloy generally used to the surfaces consistently., Article, 信州大学工学部紀要 14: 57-66 (1962)},
 pages = {57--66},
 title = {Si への Ag-Cu 系合金オーミックコンタクト：蒸着法},
 volume = {14},
 year = {1962}
}