{"created":"2021-03-01T06:16:02.555466+00:00","id":13120,"links":{},"metadata":{"_buckets":{"deposit":"0a4cbc7c-08b6-4373-b4a5-e07c75fd0496"},"_deposit":{"id":"13120","owners":[],"pid":{"revision_id":0,"type":"depid","value":"13120"},"status":"published"},"_oai":{"id":"oai:soar-ir.repo.nii.ac.jp:00013120","sets":["1221:1223:1224:1293"]},"author_link":["39978","39979"],"item_10_biblio_info_6":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"1962-12-28","bibliographicIssueDateType":"Issued"},"bibliographicPageEnd":"66","bibliographicPageStart":"57","bibliographicVolumeNumber":"14","bibliographic_titles":[{"bibliographic_title":"信州大学工学部紀要"}]}]},"item_10_description_20":{"attribute_name":"抄録","attribute_value_mlt":[{"subitem_description":"In general, noble metals, Ag and Cu, are melleable and stable against corrosion, so that these metals are used with other metals to obtain soldering materials, such as silver solder, german silver solder. It has been found out that alloys Cux Ag₁₋x in the Ag-Cu system, especially Cu₂₈ Ag₇₂, are suitable to obtain ohmic contacts to p and n type silicon, heating substrates above 300℃ and evaporating the alloy on it in vacuum. Metal surfaces obtained by means of evaporation method using Ag-Cu alloys, are acceptable in soldering Sn-Pb alloy generally used to the surfaces consistently.","subitem_description_type":"Abstract"}]},"item_10_description_30":{"attribute_name":"資源タイプ（コンテンツの種類）","attribute_value_mlt":[{"subitem_description":"Article","subitem_description_type":"Other"}]},"item_10_description_5":{"attribute_name":"引用","attribute_value_mlt":[{"subitem_description":"信州大学工学部紀要 14: 57-66 (1962)","subitem_description_type":"Other"}]},"item_10_publisher_4":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"信州大学工学部"}]},"item_10_source_id_35":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"0037-3818","subitem_source_identifier_type":"ISSN"}]},"item_10_source_id_40":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_source_identifier":"AN00121228","subitem_source_identifier_type":"NCID"}]},"item_1627890569677":{"attribute_name":"出版タイプ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_970fb48d4fbd8a85","subitem_version_type":"VoR"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"小沼,  義治","creatorNameLang":"ja"}],"nameIdentifiers":[{"nameIdentifier":"39978","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"小山,  恒夫","creatorNameLang":"ja"}],"nameIdentifiers":[{"nameIdentifier":"39979","nameIdentifierScheme":"WEKO"}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2015-09-28"}],"displaytype":"detail","filename":"Engineering14-05.pdf","filesize":[{"value":"735.0 kB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"Engineering14-05.pdf","url":"https://soar-ir.repo.nii.ac.jp/record/13120/files/Engineering14-05.pdf"},"version_id":"b1e0d51b-8226-451c-a865-67b49c8fb28b"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"departmental bulletin paper","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"Si への Ag-Cu 系合金オーミックコンタクト：蒸着法","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"Si への Ag-Cu 系合金オーミックコンタクト：蒸着法","subitem_title_language":"ja"},{"subitem_title":"Ohmic Contacts to Silicon using Ag-Cu Alloys","subitem_title_language":"en"}]},"item_type_id":"10","owner":"1","path":["1293"],"pubdate":{"attribute_name":"PubDate","attribute_value":"2009-03-30"},"publish_date":"2009-03-30","publish_status":"0","recid":"13120","relation_version_is_last":true,"title":["Si への Ag-Cu 系合金オーミックコンタクト：蒸着法"],"weko_creator_id":"1","weko_shared_id":-1},"updated":"2023-03-16T04:46:51.702010+00:00"}