| Item type |
学術雑誌論文 / Journal Article(1) |
| 公開日 |
2021-01-13 |
| タイトル |
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|
タイトル |
Communication-Fabrication of a Uniformly Tin-Coated Three-Dimensional Copper Nanostructured Architecture by Electrodeposition |
| 言語 |
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|
言語 |
eng |
| DOI |
|
|
|
関連識別子 |
https://doi.org/10.1149/2.0831602jes |
|
|
関連名称 |
10.1149/2.0831602jes |
| 資源タイプ |
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資源 |
http://purl.org/coar/resource_type/c_6501 |
|
タイプ |
journal article |
| 著者 |
Arai, Susumu
Mendsaikhan, Munkhbat
Nishimura, Koichi
|
| 信州大学研究者総覧へのリンク |
|
|
氏名 |
Arai, Susumu |
|
URL |
http://soar-rd.shinshu-u.ac.jp/profile/ja.jUyhbpkh.html |
| 出版者 |
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|
出版者 |
ELECTROCHEMICAL SOC INC |
| 引用 |
|
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内容記述 |
JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 163(2):D54-D56 (2016) |
| 書誌情報 |
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
巻 163,
号 2,
p. D54-D56,
発行日 2016
|
| 抄録 |
|
|
内容記述 |
A three-dimensional copper nanostructure architecture (3DC1) coated uniformly with a tin film was fabricated by electrodeposition. In these trials, a pyrophosphate bath was used for tin plating, and the effects of polyethylene glycol and formaldehyde additives on the morphology of the deposited tin were investigated. Relatively large tin particles were electrodeposited in an inhomogeneous manner over the 3DC1 surface when using a plating bath without additives. In contrast, 3DC1 coated with a uniformly thick tin film was fabricated by employing a bath with the additives. (C) The Author(s) 2015. Published by ECS. |
| 資源タイプ（コンテンツの種類） |
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| ISSN |
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収録物識別子タイプ |
ISSN |
|
収録物識別子 |
0013-4651 |
| 書誌レコードID |
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収録物識別子タイプ |
NCID |
|
収録物識別子 |
AA00697016 |
| 権利 |
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|
権利情報 |
© The Author(s) 2015. Published by ECS. This is an open access article distributed under the terms of the Creative Commons Attribution 4.0 License (CC BY, http://creativecommons.org/licenses/by/4.0/), which permits unrestricted reuse of the work in any medium, provided the original work is properly cited. |
| 出版タイプ |
|
|
出版タイプ |
VoR |
|
出版タイプResource |
http://purl.org/coar/version/c_970fb48d4fbd8a85 |
| WoS |
|
|
URL |
http://gateway.isiknowledge.com/gateway/Gateway.cgi?&GWVersion=2&SrcAuth=ShinshuUniv&SrcApp=ShinshuUniv&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000367324400054 |
Arai_2016_J._Electrochem._Soc._163_D54.pdf (1.5 MB)
