@article{oai:soar-ir.repo.nii.ac.jp:00021687,
 author = {Arai, Susumu and Mendsaikhan, Munkhbat and Nishimura, Koichi},
 issue = {2},
 journal = {JOURNAL OF THE ELECTROCHEMICAL SOCIETY},
 month = {},
 note = {A three-dimensional copper nanostructure architecture (3DC1) coated uniformly with a tin film was fabricated by electrodeposition. In these trials, a pyrophosphate bath was used for tin plating, and the effects of polyethylene glycol and formaldehyde additives on the morphology of the deposited tin were investigated. Relatively large tin particles were electrodeposited in an inhomogeneous manner over the 3DC1 surface when using a plating bath without additives. In contrast, 3DC1 coated with a uniformly thick tin film was fabricated by employing a bath with the additives. (C) The Author(s) 2015. Published by ECS., Article, JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 163(2):D54-D56 (2016)},
 pages = {D54--D56},
 title = {Communication-Fabrication of a Uniformly Tin-Coated Three-Dimensional Copper Nanostructured Architecture by Electrodeposition},
 volume = {163},
 year = {2016}
}