{"created":"2021-03-01T06:24:50.432090+00:00","id":21687,"links":{},"metadata":{"_buckets":{"deposit":"1f111c83-89aa-47fa-a2aa-d4c78c954a8f"},"_deposit":{"id":"21687","owners":[],"pid":{"revision_id":0,"type":"depid","value":"21687"},"status":"published"},"_oai":{"id":"oai:soar-ir.repo.nii.ac.jp:00021687","sets":["1221:1222"]},"author_link":["110015","110016","110017"],"item_1628147817048":{"attribute_name":"出版タイプ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_970fb48d4fbd8a85","subitem_version_type":"VoR"}]},"item_6_biblio_info_6":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2016","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"2","bibliographicPageEnd":"D56","bibliographicPageStart":"D54","bibliographicVolumeNumber":"163","bibliographic_titles":[{"bibliographic_title":"JOURNAL OF THE ELECTROCHEMICAL SOCIETY"}]}]},"item_6_description_20":{"attribute_name":"抄録","attribute_value_mlt":[{"subitem_description":"A three-dimensional copper nanostructure architecture (3DC1) coated uniformly with a tin film was fabricated by electrodeposition. In these trials, a pyrophosphate bath was used for tin plating, and the effects of polyethylene glycol and formaldehyde additives on the morphology of the deposited tin were investigated. Relatively large tin particles were electrodeposited in an inhomogeneous manner over the 3DC1 surface when using a plating bath without additives. In contrast, 3DC1 coated with a uniformly thick tin film was fabricated by employing a bath with the additives. (C) The Author(s) 2015. Published by ECS.","subitem_description_type":"Abstract"}]},"item_6_description_30":{"attribute_name":"資源タイプ（コンテンツの種類）","attribute_value_mlt":[{"subitem_description":"Article","subitem_description_type":"Other"}]},"item_6_description_5":{"attribute_name":"引用","attribute_value_mlt":[{"subitem_description":"JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 163(2):D54-D56 (2016)","subitem_description_type":"Other"}]},"item_6_link_3":{"attribute_name":"信州大学研究者総覧へのリンク","attribute_value_mlt":[{"subitem_link_text":"Arai, Susumu","subitem_link_url":"http://soar-rd.shinshu-u.ac.jp/profile/ja.jUyhbpkh.html"}]},"item_6_link_67":{"attribute_name":"WoS","attribute_value_mlt":[{"subitem_link_url":"http://gateway.isiknowledge.com/gateway/Gateway.cgi?&GWVersion=2&SrcAuth=ShinshuUniv&SrcApp=ShinshuUniv&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000367324400054"}]},"item_6_publisher_4":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"ELECTROCHEMICAL SOC INC"}]},"item_6_relation_48":{"attribute_name":"DOI","attribute_value_mlt":[{"subitem_relation_name":[{"subitem_relation_name_text":"10.1149/2.0831602jes"}],"subitem_relation_type_id":{"subitem_relation_type_id_text":"https://doi.org/10.1149/2.0831602jes","subitem_relation_type_select":"DOI"}}]},"item_6_rights_62":{"attribute_name":"権利","attribute_value_mlt":[{"subitem_rights":"© The Author(s) 2015. Published by ECS. This is an open access article distributed under the terms of the Creative Commons Attribution 4.0 License (CC BY, http://creativecommons.org/licenses/by/4.0/), which permits unrestricted reuse of the work in any medium, provided the original work is properly cited."}]},"item_6_source_id_35":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"0013-4651","subitem_source_identifier_type":"ISSN"}]},"item_6_source_id_40":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_source_identifier":"AA00697016","subitem_source_identifier_type":"NCID"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"Arai, Susumu"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Mendsaikhan, Munkhbat"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Nishimura, Koichi"}],"nameIdentifiers":[{}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2021-01-13"}],"displaytype":"detail","filename":"Arai_2016_J._Electrochem._Soc._163_D54.pdf","filesize":[{"value":"1.5 MB"}],"format":"application/pdf","licensefree":"© The Author(s) 2015. Published by ECS. This is an open access article distributed under the terms of the Creative Commons Attribution 4.0 License (CC BY, http://creativecommons.org/licenses/by/4.0/), which permits unrestricted reuse of the work in any medium, provided the original work is properly cited.","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"Arai_2016_J._Electrochem._Soc._163_D54.pdf","url":"https://soar-ir.repo.nii.ac.jp/record/21687/files/Arai_2016_J._Electrochem._Soc._163_D54.pdf"},"version_id":"3f8b55a6-1b69-47e8-9ece-6dbb0a68fa62"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"eng"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"journal article","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"Communication-Fabrication of a Uniformly Tin-Coated Three-Dimensional Copper Nanostructured Architecture by Electrodeposition","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"Communication-Fabrication of a Uniformly Tin-Coated Three-Dimensional Copper Nanostructured Architecture by Electrodeposition","subitem_title_language":"en"}]},"item_type_id":"6","owner":"1","path":["1222"],"pubdate":{"attribute_name":"PubDate","attribute_value":"2021-01-13"},"publish_date":"2021-01-13","publish_status":"0","recid":"21687","relation_version_is_last":true,"title":["Communication-Fabrication of a Uniformly Tin-Coated Three-Dimensional Copper Nanostructured Architecture by Electrodeposition"],"weko_creator_id":"1","weko_shared_id":-1},"updated":"2022-12-14T04:19:33.424315+00:00"}