@article{oai:soar-ir.repo.nii.ac.jp:00021691,
 author = {Arai, Susumu and Ozawa, Masaya and Shimizu, Masahiro},
 issue = {2},
 journal = {JOURNAL OF THE ELECTROCHEMICAL SOCIETY},
 month = {},
 note = {Micro-scale columnar architectures composed of copper sheets with nanometer thickness were fabricated by electrodeposition using a photolithography technique. A copper sulfate solution containing a polyacrylic acid was used as the plating bath, and the electrodeposition was conducted under galvanostatic conditions. Patterned electrodeposits with a cylindrical shape and composed of thin copper sheets were formed. Every copper deposit had openings on the top and side regions and also had a porous interior. This novel three-dimensional (3D) copper architecture should provide functional copper electrodes with large effective surface areas. (C) The Author(s) 2016. Published by ECS. All rights reserved., Article, JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 164(2):D72-D74 (2017)},
 pages = {D72--D74},
 title = {Communication-Micro-Scale Columnar Architecture Composed of Copper Nano Sheets by Electrodeposition Technique},
 volume = {164},
 year = {2017}
}