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Ni–P alloy–MWCNT composite films containing 20–22 atom % P and 0.7–1.2 mass % MWCNTs were electrodeposited from a composite plating bath. MWCNTs were embedded relatively uniformly in the Ni–P alloy matrix. 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Ni-P alloy-MWCNT composite films containing 20-22 atom % P and 0.7-1.2 mass % MWCNTs were electrodeposited from a composite plating bath. MWCNTs were embedded relatively uniformly in the Ni-P alloy matrix. The hardness of the composite films was higher than that of the Ni-P alloy films, both before and after heat-treatment, and the friction coefficient of the composite films was lower than that of the Ni-P alloy films. (C) 2009 The Electrochemical Society. 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