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  1. 060 工学部
  2. 0601 学術論文

Cu-MWCNT Composite Films Fabricated by Electrodeposition

http://hdl.handle.net/10091/10861
http://hdl.handle.net/10091/10861
391d40c9-487c-4163-a0c7-074a402369a2
名前 / ファイル ライセンス アクション
Cu–MWCNT_Composite_Films.pdf Cu–MWCNT_Composite_Films.pdf (1.3 MB)
Item type 学術雑誌論文 / Journal Article(1)
公開日 2011-01-05
タイトル
言語 en
タイトル Cu-MWCNT Composite Films Fabricated by Electrodeposition
言語
言語 eng
キーワード
主題Scheme Other
主題 carbon nanotubes
キーワード
主題Scheme Other
主題 copper
キーワード
主題Scheme Other
主題 current density
キーワード
主題Scheme Other
主題 electrical conductivity
キーワード
主題Scheme Other
主題 electrical resistivity
キーワード
主題Scheme Other
主題 electrodeposition
キーワード
主題Scheme Other
主題 hardness
キーワード
主題Scheme Other
主題 internal stresses
キーワード
主題Scheme Other
主題 materials preparation
キーワード
主題Scheme Other
主題 metallic thin films
キーワード
主題Scheme Other
主題 nanocomposites
キーワード
主題Scheme Other
主題 nanofabrication
キーワード
主題Scheme Other
主題 surface morphology
キーワード
主題Scheme Other
主題 thermal conductivity
資源タイプ
資源 http://purl.org/coar/resource_type/c_6501
タイプ journal article
著者 Arai, Susumu

× Arai, Susumu

WEKO 38164

Arai, Susumu

Search repository
Saito, Takashi

× Saito, Takashi

WEKO 38165

Saito, Takashi

Search repository
Endo, Morinobu

× Endo, Morinobu

WEKO 38166

Endo, Morinobu

Search repository
信州大学研究者総覧へのリンク
氏名 Arai, Susumu
URL http://soar-rd.shinshu-u.ac.jp/profile/ja.jUyhbpkh.html
信州大学研究者総覧へのリンク
氏名 Endo, Morinobu
URL http://soar-rd.shinshu-u.ac.jp/profile/ja.uUTmZhkh.html
出版者
出版者 ELECTROCHEMICAL SOC INC
引用
内容記述タイプ Other
内容記述 JOURNAL OF THE ELECTROCHEMICAL SOCIETY
書誌情報 JOURNAL OF THE ELECTROCHEMICAL SOCIETY

巻 157, 号 3, p. D147-D153, 発行日 2010-01-12
抄録
内容記述タイプ Abstract
内容記述 Copper–multiwalled carbon nanotube (MWCNT) composite plating using a sulfuric base bath was studied. A dispersing agent was used to disperse the MWCNTs into the plating bath. The effects of electrodeposition conditions on the surface morphology, microstructure, and MWCNT content in the composite films were examined. The internal stress, hardness, electrical conductivity, and thermal conductivity of the composite films were also investigated. The current density remarkably affected the surface morphologies of the films, and a relatively smooth surface was obtained at lower current densities. The bath temperature affected the microstructure of the composite films; a compact microstructure was formed at a lower temperature. The MWCNT content in the composite film increased with increasing MWCNT concentration in the plating bath, reaching a maximum value of 0.55 mass %. However, MWCNTs in the composite films tended to agglomerate for high MWCNT concentrations in the plating bath. An internal tensile stress was induced in the films. The hardness of the films was around 150 HV, and the electrical resistivity was approximately 2–2.5μΩ cm. The thermal conductivity of the Cu–0.42 mass % MWCNT composite film was 355 W m⁻¹ K⁻¹.
資源タイプ(コンテンツの種類)
内容記述タイプ Other
内容記述 Article
ISSN
収録物識別子タイプ ISSN
収録物識別子 0013-4651
書誌レコードID
収録物識別子タイプ NCID
収録物識別子 AA00697016
DOI
識別子タイプ DOI
関連識別子 https://doi.org/10.1149/1.3280034
関連名称 10.1149/1.3280034
権利
権利情報 Copyright (c) The Electrochemical Society, Inc. 2010. All rights reserved. Except as provided under U.S. copyright law, this work may not be reproduced, resold, distributed, or modified without the express permission of The Electrochemical Society (ECS). The archival version of this work was published in J. Electrochem. Soc. 157(3):D147-D153 (2010), DOI:10.1149/1.3280034
出版タイプ
出版タイプ VoR
出版タイプResource http://purl.org/coar/version/c_970fb48d4fbd8a85
WoS
表示名 Web of Science
URL http://gateway.isiknowledge.com/gateway/Gateway.cgi?&GWVersion=2&SrcAuth=ShinshuUniv&SrcApp=ShinshuUniv&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000274321900050
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