{"_buckets": {"deposit": "4b9061ce-81bd-4c8a-8d99-7f5b26c97ee2"}, "_deposit": {"id": "12504", "owners": [], "pid": {"revision_id": 0, "type": "depid", "value": "12504"}, "status": "published"}, "_oai": {"id": "oai:soar-ir.repo.nii.ac.jp:00012504", "sets": ["1221:1222"]}, "author_link": ["38164", "38165", "38166"], "item_1628147817048": {"attribute_name": "\u51fa\u7248\u30bf\u30a4\u30d7", "attribute_value_mlt": [{"subitem_version_resource": "http://purl.org/coar/version/c_970fb48d4fbd8a85", "subitem_version_type": "VoR"}]}, "item_6_biblio_info_6": {"attribute_name": "\u66f8\u8a8c\u60c5\u5831", "attribute_value_mlt": [{"bibliographicIssueDates": {"bibliographicIssueDate": "2010-01-12", "bibliographicIssueDateType": "Issued"}, "bibliographicIssueNumber": "3", "bibliographicPageEnd": "D153", "bibliographicPageStart": "D147", "bibliographicVolumeNumber": "157", "bibliographic_titles": [{"bibliographic_title": "JOURNAL OF THE ELECTROCHEMICAL SOCIETY"}]}]}, "item_6_description_20": {"attribute_name": "\u6284\u9332", "attribute_value_mlt": [{"subitem_description": "Copper\u2013multiwalled carbon nanotube (MWCNT) composite plating using a sulfuric base bath was studied. A dispersing agent was used to disperse the MWCNTs into the plating bath. The effects of electrodeposition conditions on the surface morphology, microstructure, and MWCNT content in the composite films were examined. The internal stress, hardness, electrical conductivity, and thermal conductivity of the composite films were also investigated. The current density remarkably affected the surface morphologies of the films, and a relatively smooth surface was obtained at lower current densities. The bath temperature affected the microstructure of the composite films; a compact microstructure was formed at a lower temperature. The MWCNT content in the composite film increased with increasing MWCNT concentration in the plating bath, reaching a maximum value of 0.55 mass %. However, MWCNTs in the composite films tended to agglomerate for high MWCNT concentrations in the plating bath. An internal tensile stress was induced in the films. The hardness of the films was around 150 HV, and the electrical resistivity was approximately 2\u20132.5\u03bc\u03a9 cm. The thermal conductivity of the Cu\u20130.42 mass % MWCNT composite film was 355  W  m\u207b\u00b9 K\u207b\u00b9.", "subitem_description_type": "Abstract"}]}, "item_6_description_30": {"attribute_name": "\u8cc7\u6e90\u30bf\u30a4\u30d7\uff08\u30b3\u30f3\u30c6\u30f3\u30c4\u306e\u7a2e\u985e\uff09", "attribute_value_mlt": [{"subitem_description": "Article", "subitem_description_type": "Other"}]}, "item_6_description_31": {"attribute_name": "\u30d5\u30a9\u30fc\u30de\u30c3\u30c8\uff1amime\u30bf\u30a4\u30d7", "attribute_value_mlt": [{"subitem_description": "application/pdf", "subitem_description_type": "Other"}]}, "item_6_description_5": {"attribute_name": "\u5f15\u7528", "attribute_value_mlt": [{"subitem_description": "JOURNAL OF THE ELECTROCHEMICAL SOCIETY", "subitem_description_type": "Other"}]}, "item_6_link_3": {"attribute_name": "\u4fe1\u5dde\u5927\u5b66\u7814\u7a76\u8005\u7dcf\u89a7\u3078\u306e\u30ea\u30f3\u30af", "attribute_value_mlt": [{"subitem_link_text": "Arai, Susumu", "subitem_link_url": "http://soar-rd.shinshu-u.ac.jp/profile/ja.jUyhbpkh.html"}, {"subitem_link_text": "Endo, Morinobu", "subitem_link_url": "http://soar-rd.shinshu-u.ac.jp/profile/ja.uUTmZhkh.html"}]}, "item_6_link_67": {"attribute_name": "WoS", "attribute_value_mlt": [{"subitem_link_text": "Web of Science", "subitem_link_url": "http://gateway.isiknowledge.com/gateway/Gateway.cgi?\u0026GWVersion=2\u0026SrcAuth=ShinshuUniv\u0026SrcApp=ShinshuUniv\u0026DestLinkType=FullRecord\u0026DestApp=WOS\u0026KeyUT=000274321900050"}]}, "item_6_publisher_4": {"attribute_name": "\u51fa\u7248\u8005", "attribute_value_mlt": [{"subitem_publisher": "ELECTROCHEMICAL SOC INC"}]}, "item_6_relation_48": {"attribute_name": "DOI", "attribute_value_mlt": [{"subitem_relation_name": [{"subitem_relation_name_text": "10.1149/1.3280034"}], "subitem_relation_type_id": {"subitem_relation_type_id_text": "https://doi.org/10.1149/1.3280034", "subitem_relation_type_select": "DOI"}}]}, "item_6_rights_62": {"attribute_name": "\u6a29\u5229", "attribute_value_mlt": [{"subitem_rights": "Copyright (c) The Electrochemical Society, Inc. 2010. All rights reserved. Except as provided under U.S. copyright law, this work may not be reproduced, resold, distributed, or modified without the express permission of The Electrochemical Society (ECS). The archival version of this work was published in J. Electrochem. Soc. 157(3):D147-D153 (2010), DOI:10.1149/1.3280034"}]}, "item_6_select_64": {"attribute_name": "\u8457\u8005\u7248\u30d5\u30e9\u30b0", "attribute_value_mlt": [{"subitem_select_item": "publisher"}]}, "item_6_source_id_35": {"attribute_name": "ISSN", "attribute_value_mlt": [{"subitem_source_identifier": "0013-4651", "subitem_source_identifier_type": "ISSN"}]}, "item_6_source_id_39": {"attribute_name": "NII ISSN", "attribute_value_mlt": [{"subitem_source_identifier": "0013-4651", "subitem_source_identifier_type": "ISSN"}]}, "item_6_source_id_40": {"attribute_name": "\u66f8\u8a8c\u30ec\u30b3\u30fc\u30c9ID", "attribute_value_mlt": [{"subitem_source_identifier": "AA00697016", "subitem_source_identifier_type": "NCID"}]}, "item_6_text_69": {"attribute_name": "wosonly authkey", "attribute_value_mlt": [{"subitem_text_value": "carbon nanotubes; copper; current density; electrical conductivity; electrical resistivity; electrodeposition; hardness; internal stresses; materials preparation; metallic thin films; nanocomposites; nanofabrication; surface morphology; thermal conductivity"}]}, "item_6_text_70": {"attribute_name": "wosonly keywords", "attribute_value_mlt": [{"subitem_text_value": "CARBON NANOTUBES; COATINGS; BEHAVIOR"}]}, "item_6_textarea_68": {"attribute_name": "wosonly abstract", "attribute_value_mlt": [{"subitem_textarea_value": "Copper-multiwalled carbon nanotube (MWCNT) composite plating using a sulfuric base bath was studied. A dispersing agent was used to disperse the MWCNTs into the plating bath. The effects of electrodeposition conditions on the surface morphology, microstructure, and MWCNT content in the composite films were examined. The internal stress, hardness, electrical conductivity, and thermal conductivity of the composite films were also investigated. The current density remarkably affected the surface morphologies of the films, and a relatively smooth surface was obtained at lower current densities. The bath temperature affected the microstructure of the composite films; a compact microstructure was formed at a lower temperature. The MWCNT content in the composite film increased with increasing MWCNT concentration in the plating bath, reaching a maximum value of 0.55 mass %. However, MWCNTs in the composite films tended to agglomerate for high MWCNT concentrations in the plating bath. An internal tensile stress was induced in the films. The hardness of the films was around 150 HV, and the electrical resistivity was approximately 2-2.5 mu cm. The thermal conductivity of the Cu-0.42 mass % MWCNT composite film was 355 W m(-1) K-1."}]}, "item_creator": {"attribute_name": "\u8457\u8005", "attribute_type": "creator", "attribute_value_mlt": [{"creatorNames": [{"creatorName": "Arai,  Susumu"}], "nameIdentifiers": [{"nameIdentifier": "38164", "nameIdentifierScheme": "WEKO"}]}, {"creatorNames": [{"creatorName": "Saito,  Takashi"}], "nameIdentifiers": [{"nameIdentifier": "38165", "nameIdentifierScheme": "WEKO"}]}, {"creatorNames": [{"creatorName": "Endo,  Morinobu"}], "nameIdentifiers": [{"nameIdentifier": "38166", "nameIdentifierScheme": "WEKO"}]}]}, "item_files": {"attribute_name": "\u30d5\u30a1\u30a4\u30eb\u60c5\u5831", "attribute_type": "file", "attribute_value_mlt": [{"accessrole": "open_date", "date": [{"dateType": "Available", "dateValue": "2015-09-28"}], "displaytype": "detail", "download_preview_message": "", "file_order": 0, "filename": "Cu\u2013MWCNT_Composite_Films.pdf", "filesize": [{"value": "1.3 MB"}], "format": "application/pdf", "future_date_message": "", "is_thumbnail": false, "licensetype": "license_note", "mimetype": "application/pdf", "size": 1300000.0, "url": {"label": "Cu\u2013MWCNT_Composite_Films.pdf", "url": "https://soar-ir.repo.nii.ac.jp/record/12504/files/Cu\u2013MWCNT_Composite_Films.pdf"}, "version_id": "ac0cc863-f10f-47a5-94c8-15f3cbc73a5e"}]}, "item_keyword": {"attribute_name": "\u30ad\u30fc\u30ef\u30fc\u30c9", "attribute_value_mlt": [{"subitem_subject": "carbon nanotubes", "subitem_subject_scheme": "Other"}, {"subitem_subject": "copper", "subitem_subject_scheme": "Other"}, {"subitem_subject": "current density", "subitem_subject_scheme": "Other"}, {"subitem_subject": "electrical conductivity", "subitem_subject_scheme": "Other"}, {"subitem_subject": "electrical resistivity", "subitem_subject_scheme": "Other"}, {"subitem_subject": "electrodeposition", "subitem_subject_scheme": "Other"}, {"subitem_subject": "hardness", "subitem_subject_scheme": "Other"}, {"subitem_subject": "internal stresses", "subitem_subject_scheme": "Other"}, {"subitem_subject": "materials preparation", "subitem_subject_scheme": "Other"}, {"subitem_subject": "metallic thin films", "subitem_subject_scheme": "Other"}, {"subitem_subject": "nanocomposites", "subitem_subject_scheme": "Other"}, {"subitem_subject": "nanofabrication", "subitem_subject_scheme": "Other"}, {"subitem_subject": "surface morphology", "subitem_subject_scheme": "Other"}, {"subitem_subject": "thermal conductivity", "subitem_subject_scheme": "Other"}]}, "item_language": {"attribute_name": "\u8a00\u8a9e", "attribute_value_mlt": [{"subitem_language": "eng"}]}, "item_resource_type": {"attribute_name": "\u8cc7\u6e90\u30bf\u30a4\u30d7", "attribute_value_mlt": [{"resourcetype": "journal article", "resourceuri": "http://purl.org/coar/resource_type/c_6501"}]}, "item_title": "Cu-MWCNT Composite Films Fabricated by Electrodeposition", "item_titles": {"attribute_name": "\u30bf\u30a4\u30c8\u30eb", "attribute_value_mlt": [{"subitem_title": "Cu-MWCNT Composite Films Fabricated by Electrodeposition", "subitem_title_language": "en"}]}, "item_type_id": "6", "owner": "1", "path": ["1221/1222"], "permalink_uri": "http://hdl.handle.net/10091/10861", "pubdate": {"attribute_name": "PubDate", "attribute_value": "2011-01-05"}, "publish_date": "2011-01-05", "publish_status": "0", "recid": "12504", "relation": {}, "relation_version_is_last": true, "title": ["Cu-MWCNT Composite Films Fabricated by Electrodeposition"], "weko_shared_id": -1}