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  1. 060 工学部
  2. 0601 学術論文

Fabrication of high thermal conductivity copper/diamond composites by electrodeposition under potentiostatic conditions

http://hdl.handle.net/10091/00022450
71939e77-256b-465f-b6d8-5c4f4217bacc
名前 / ファイル ライセンス アクション
Arai-Ueda2020_Article_FabricationOfHighThermalConduc.pdf Arai-Ueda2020_Article_FabricationOfHighThermalConduc.pdf (1.7 MB)
Item type 学術雑誌論文 / Journal Article(1)
公開日 2021-01-13
タイトル
言語 en
タイトル Fabrication of high thermal conductivity copper/diamond composites by electrodeposition under potentiostatic conditions
言語
言語 eng
キーワード
主題Scheme Other
主題 Copper
キーワード
主題Scheme Other
主題 Diamond
キーワード
主題Scheme Other
主題 Composite
キーワード
主題Scheme Other
主題 Thermal conductivity
キーワード
主題Scheme Other
主題 Electrodeposition
キーワード
主題Scheme Other
主題 Galvanostatic condition
キーワード
主題Scheme Other
主題 Potentiostatic condition
資源タイプ
資源 http://purl.org/coar/resource_type/c_6501
タイプ journal article
著者 Arai, Susumu

× Arai, Susumu

WEKO 110032

Arai, Susumu

Search repository
Ueda, Miyoka

× Ueda, Miyoka

WEKO 110033

Ueda, Miyoka

Search repository
信州大学研究者総覧へのリンク
氏名 Arai, Susumu
URL http://soar-rd.shinshu-u.ac.jp/profile/ja.jUyhbpkh.html
出版者
出版者 SPRINGER
引用
内容記述タイプ Other
内容記述 JOURNAL OF APPLIED ELECTROCHEMISTRY. 50(5):631-638 (2020)
書誌情報 JOURNAL OF APPLIED ELECTROCHEMISTRY

巻 50, 号 5, p. 631-638, 発行日 2020-05
抄録
内容記述タイプ Abstract
内容記述 High thermal conductivity Cu/diamond composites were fabricated using an electrodeposition technique. The electrodes were oriented horizontally, and the cathode was located at the bottom of the plating bath. Diamond particles (10-230 mu m) were first precipitated on the cathode substrate, and then copper was electrodeposited on the substrate to fill the gap between the precipitated diamond particles, which resulted in the formation of a Cu/diamond composite. The deposition behavior of the copper was electrochemically investigated, and the current densities of copper deposition under galvanostatic conditions were estimated. The current densities for the substrate with diamond particle layers were 4-10 times higher than the current density for the substrate without diamond particle layers, which led to undesired hydrogen evolution. Cu/diamond composites were formed under potentiostatic conditions without hydrogen evolution, and the resultant composites had compact morphologies. A specimen containing 49 vol% diamond particles with a mean diameter of 230 mu m had the highest thermal conductivity of 600 W m(-1) K-1, which is 1.5 times that of pure copper (ca. 400 W m(-1) K-1). Graphic High thermal conductivity Cu/diamond composites were fabricated by electrodeposition under a potentiostatic condition without the evolution of hydrogen gas.
資源タイプ(コンテンツの種類)
内容記述タイプ Other
内容記述 Article
ISSN
収録物識別子タイプ ISSN
収録物識別子 0021-891X
書誌レコードID
収録物識別子タイプ NCID
収録物識別子 AA00693445
DOI
関連識別子
識別子タイプ DOI
関連識別子 https://doi.org/10.1007/s10800-020-01414-3
関連名称
関連名称 10.1007/s10800-020-01414-3
権利
権利情報 © The Author(s) 2020. This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons licence, and indicate if changes were made. The images or other third party material in this article are included in the article's Creative Commons licence, unless indicated otherwise in a credit line to the material. If material is not included in the article's Creative Commons licence and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this licence, visit http://creativecommons.org/licenses/by/4.0/.
出版タイプ
出版タイプ VoR
出版タイプResource http://purl.org/coar/version/c_970fb48d4fbd8a85
WoS
表示名 Web of Science
URL http://gateway.isiknowledge.com/gateway/Gateway.cgi?&GWVersion=2&SrcAuth=ShinshuUniv&SrcApp=ShinshuUniv&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000527948600010
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