WEKO3
-
RootNode
アイテム
Li-insertion/extraction properties of three-dimensional Sn electrode prepared by facile electrodeposition method
http://hdl.handle.net/10091/00021825
http://hdl.handle.net/10091/000218251ba9c352-7055-4242-bb56-ceed77235408
名前 / ファイル | ライセンス | アクション |
---|---|---|
![]() |
|
|
![]() |
|
Item type | 学術雑誌論文 / Journal Article(1) | |||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|
公開日 | 2020-01-30 | |||||||||||
タイトル | ||||||||||||
タイトル | Li-insertion/extraction properties of three-dimensional Sn electrode prepared by facile electrodeposition method | |||||||||||
言語 | ||||||||||||
言語 | eng | |||||||||||
DOI | ||||||||||||
関連識別子 | https://doi.org/10.1007/s10800-017-1075-0 | |||||||||||
関連名称 | 10.1007/s10800-017-1075-0 | |||||||||||
キーワード | ||||||||||||
主題 | Electrodeposition, Sn electrode, Li-ion battery, Three-dimensional structure, Current collector | |||||||||||
資源タイプ | ||||||||||||
資源 | http://purl.org/coar/resource_type/c_6501 | |||||||||||
タイプ | journal article | |||||||||||
著者 |
Shimizu, Masahiro
× Shimizu, Masahiro
× Munkhbat, Mendsaikhan
× Arai, Susumu
|
|||||||||||
信州大学研究者総覧へのリンク | ||||||||||||
氏名 | Shimizu, Masahiro | |||||||||||
URL | http://soar-rd.shinshu-u.ac.jp/profile/ja.gCkVbUkh.html | |||||||||||
信州大学研究者総覧へのリンク | ||||||||||||
氏名 | Arai, Susumu | |||||||||||
URL | http://soar-rd.shinshu-u.ac.jp/profile/ja.jUyhbpkh.html | |||||||||||
出版者 | ||||||||||||
出版者 | SPRINGER | |||||||||||
引用 | ||||||||||||
内容記述 | JOURNAL OF APPLIED ELECTROCHEMISTRY.47(6):727-734(2017) | |||||||||||
書誌情報 |
JOURNAL OF APPLIED ELECTROCHEMISTRY 巻 47, 号 6, p. 727-734, 発行日 2017-04-18 |
|||||||||||
抄録 | ||||||||||||
内容記述 | Toward the realization of reliable Li-ion batteries with high performance and safety, component materials such as those of the current collector and negative electrode require further innovation. Sn, one of the most promising negative-electrode materials, can be electrochemically fixed on a substrate without any binder or conductive additive. However, the pulverization of Sn-plated films on substrates caused by large volume changes during Li-Sn reactions is the main reason hindering the practical application of Sn-plated electrodes. In the present study, we developed an electrodeposited three-dimensional (3D) Cu substrate applied to underlayer of the electrode. The effect of substrate geometry on the charge-discharge performance of the Sn electrode was investigated. The 3D-Cu/Sn electrode exhibited superior cycling performance with a reversible capacity of 470 mA h g(-1) even at the 300th cycle, whereas the Sn-plated electrode prepared on a typical flat Cu substrate showed a capacity of only 20 mA h g(-1). The results demonstrated that the 3D structure played a key role in accommodating volumetric changes in the Sn to suppress electrode disintegration. The developed 3D-Cu substrate will be significantly useful as a current collector for alloy-based active materials. [GRAPHICS] . | |||||||||||
資源タイプ(コンテンツの種類) | ||||||||||||
ISSN | ||||||||||||
収録物識別子タイプ | ISSN | |||||||||||
収録物識別子 | 0021-891X | |||||||||||
書誌レコードID | ||||||||||||
収録物識別子タイプ | NCID | |||||||||||
収録物識別子 | AA11981601 | |||||||||||
権利 | ||||||||||||
権利情報 | This is a post-peer-review, pre-copyedit version of an article published in JOURNAL OF APPLIED ELECTROCHEMISTRY. The final authenticated version is available online at: https://doi.org/10.1007/s10800-017-1075-0 | |||||||||||
出版タイプ | ||||||||||||
出版タイプ | AM | |||||||||||
出版タイプResource | http://purl.org/coar/version/c_ab4af688f83e57aa | |||||||||||
WoS | ||||||||||||
URL | http://gateway.isiknowledge.com/gateway/Gateway.cgi?&GWVersion=2&SrcAuth=ShinshuUniv&SrcApp=ShinshuUniv&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000400890300006 |
Share
Cite as
Shimizu, Masahiro, Munkhbat, Mendsaikhan, Arai, Susumu, 2017, Li-insertion/extraction properties of three-dimensional Sn electrode prepared by facile electrodeposition method: SPRINGER, 727–734 p.
Loading...