{"_buckets": {"deposit": "014ac57d-7168-4dea-a953-94a2e33a08b2"}, "_deposit": {"id": "21068", "owners": [], "pid": {"revision_id": 0, "type": "depid", "value": "21068"}, "status": "published"}, "_oai": {"id": "oai:soar-ir.repo.nii.ac.jp:00021068", "sets": ["1221:1222"]}, "item_6_biblio_info_6": {"attribute_name": "\u66f8\u8a8c\u60c5\u5831", "attribute_value_mlt": [{"bibliographicIssueDates": {"bibliographicIssueDate": "2017-04-18", "bibliographicIssueDateType": "Issued"}, "bibliographicIssueNumber": "6", "bibliographicPageEnd": "734", "bibliographicPageStart": "727", "bibliographicVolumeNumber": "47", "bibliographic_titles": [{"bibliographic_title": "JOURNAL OF APPLIED ELECTROCHEMISTRY"}]}]}, "item_6_description_20": {"attribute_name": "\u6284\u9332", "attribute_value_mlt": [{"subitem_description": "Toward the realization of reliable Li-ion batteries with high performance and safety, component materials such as those of the current collector and negative electrode require further innovation. Sn, one of the most promising negative-electrode materials, can be electrochemically fixed on a substrate without any binder or conductive additive. However, the pulverization of Sn-plated films on substrates caused by large volume changes during Li-Sn reactions is the main reason hindering the practical application of Sn-plated electrodes. In the present study, we developed an electrodeposited three-dimensional (3D) Cu substrate applied to underlayer of the electrode. The effect of substrate geometry on the charge-discharge performance of the Sn electrode was investigated. The 3D-Cu/Sn electrode exhibited superior cycling performance with a reversible capacity of 470 mA h g(-1) even at the 300th cycle, whereas the Sn-plated electrode prepared on a typical flat Cu substrate showed a capacity of only 20 mA h g(-1). The results demonstrated that the 3D structure played a key role in accommodating volumetric changes in the Sn to suppress electrode disintegration. The developed 3D-Cu substrate will be significantly useful as a current collector for alloy-based active materials. 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Sn, one of the most promising negative-electrode materials, can be electrochemically fixed on a substrate without any binder or conductive additive. However, the pulverization of Sn-plated films on substrates caused by large volume changes during Li-Sn reactions is the main reason hindering the practical application of Sn-plated electrodes. In the present study, we developed an electrodeposited three-dimensional (3D) Cu substrate applied to underlayer of the electrode. The effect of substrate geometry on the charge-discharge performance of the Sn electrode was investigated. The 3D-Cu/Sn electrode exhibited superior cycling performance with a reversible capacity of 470 mA h g(-1) even at the 300th cycle, whereas the Sn-plated electrode prepared on a typical flat Cu substrate showed a capacity of only 20 mA h g(-1). The results demonstrated that the 3D structure played a key role in accommodating volumetric changes in the Sn to suppress electrode disintegration. The developed 3D-Cu substrate will be significantly useful as a current collector for alloy-based active materials. 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